International Journal of Terahertz Science and Technology
  TST >> Vol.12, No.2, June 2019: PP. 33-56
 

(Invited paper) Terahertz microscopy and application in semiconductor testing

Limin Xu *, Tao Wang, Lianglun Cheng
Guangdong University of Technology
* Email: 19874253xulimin@163.com

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Abstract: Terahertz microscopy can be classified into two categories according to resolution, micrometer microscopy and nanometer microscopy. Typical methods for these two kinds of microscopy are analyzed with particular stress on characteristics and potential application value. Some state-of-the-art terahertz microscopy products are introduced, as well as Electro-Optical Terahertz Pulse Reflectometry that utilizes ultrafast terahertz pulses to differentiate and locate faults of integrated circuits in semiconductor failure analysis laboratories. A brief discussion on the potential applications in semiconductor industry compared with other techniques is given in the final part to help those engaged in related research and development activities.

Keywords: Terahertz microscopy, Semiconductor Industry, Non-destructive testing.

Received: 2019-6-11

Published: 2019-6-30

Acknowledgments: This article provides a brief review of terahertz microscopy and related technology and products that are especially useful in semiconductor NDT. Some figures are adapted directly from the literature without any change. I am also grateful for the helpful discussion on EOTPR with Walter Chen from the ACE solution Company.

Cite this article:
Limin Xu, Tao Wang, Lianglun Cheng; Terahertz microscopy and application in semiconductor testing [J]. International Journal of Terahertz Science and Technology, 2019, Vol.12, No.2: 33-47.  DOI:10.11906/TST.033-047.2019.06.04

URL: http://www.tstnetwork.org/10.11906/TST.033-047.2019.06.04

 

 
 

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